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TC4420/TC4429
6A High-Speed MOSFET Drivers
Features
* Latch-Up Protected: Will Withstand >1.5A Reverse Output Current * Logic Input Will Withstand Negative Swing Up To 5V * ESD Protected: 4 kV * Matched Rise and Fall Times: - 25 ns (2500 pF load) * High Peak Output Current: 6A * Wide Input Supply Voltage Operating Range: - 4.5V to 18V * High Capacitive Load Drive Capability: 10,000 pF * Short Delay Time: 55 ns (typ.) * CMOS/TTL Compatible Input * Low Supply Current With Logic `1' Input: - 450 A (typ.) * Low Output Impedance: 2.5 * Output Voltage Swing to Within 25 mV of Ground or VDD * Space-Saving 8-Pin SOIC and 8-Pin 6x5 DFN Packages
General Description
The TC4420/TC4429 are 6A (peak), single-output MOSFET drivers. The TC4429 is an inverting driver (pin-compatible with the TC429), while the TC4420 is a non-inverting driver. These drivers are fabricated in CMOS for lower power and more efficient operation versus bipolar drivers. Both devices have TTL/CMOS compatible inputs that can be driven as high as VDD + 0.3V or as low as -5V without upset or damage to the device. This eliminates the need for external level-shifting circuitry and its associated cost and size. The output swing is rail-to-rail, ensuring better drive voltage margin, especially during power-up/power-down sequencing. Propagational delay time is only 55 ns (typ.) and the output rise and fall times are only 25 ns (typ.) into 2500 pF across the usable power supply range. Unlike other drivers, the TC4420/TC4429 are virtually latch-up proof. They replace three or more discrete components, saving PCB area, parts and improving overall system reliability.
Applications
* * * * Switch-Mode Power Supplies Motor Controls Pulse Transformer Driver Class D Switching Amplifiers
Package Types(1)
8-Pin CERDIP/ PDIP/SOIC
VDD INPUT NC GND
1 2 3 4 8
TC4420
VDD OUTPUT OUTPUT GND
TC4429
VDD OUTPUT OUTPUT GND VDD 1 INPUT 2 NC 3 GND 4
8-Pin DFN(2)
8
TC4420 TC4429
VDD VDD
5-Pin TO-220
Tab is Common to VDD
TC4420 TC4429
7 6 5
TC4420 TC4429
7 6 5
OUTPUT OUTPUT OUTPUT OUTPUT GND GND
TC4420 TC4429
Note 1: 2:
Duplicate pins must both be connected for proper operation. Exposed pad of the DFN package is electrically isolated.
2004 Microchip Technology Inc.
INPUT GND VDD GND OUTPUT DS21419C-page 1
TC4420/TC4429
Functional Block Diagram
VDD 500 A 300 mV Output
TC4429 Inverting
Input 4.7V
TC4420 Non-Inverting
GND Effective Input C = 38 pF
DS21419C-page 2
2004 Microchip Technology Inc.
TC4420/TC4429
1.0 ELECTRICAL CHARACTERISTICS
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Supply Voltage ..................................................... +20V Input Voltage .................................. - 5V to VDD + 0.3V Input Current (VIN > VDD)................................... 50 mA Power Dissipation (TA 70C) 5-Pin TO-220 .................................................... 1.6W CERDIP ....................................................... 800 mW DFN ............................................ ...................Note 2 PDIP ............................................................ 730 mW SOIC............................................................ 470 mW Package Power Dissipation (TA 25C) 5-Pin TO-220 (With Heatsink) ........................ 12.5W Thermal Impedances (To Case) 5-Pin TO-220 RJ-C ...................................... 10C/W
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25C with 4.5V VDD 18V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Voltage Range Input Current Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Operating Input Voltage Note 1: 2: IS VDD -- -- 4.5 0.45 55 -- 1.5 150 18 mA A V VIN = 3V VIN = 0V tR tF tD1 tD2 -- -- -- -- 25 25 55 55 35 35 75 75 ns ns ns ns Figure 4-1, CL = 2,500 pF Figure 4-1, CL = 2,500 pF Figure 4-1 Figure 4-1 VOH VOL ROH ROL IPK IREV VDD - 0.025 -- -- -- -- -- -- -- 2.1 1.5 6.0 > 1.5 -- 0.025 2.8 2.5 -- -- V V A A DC TEST DC TEST IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VDD = 18V Duty cycle 2%, t 300 sec VIH VIL VIN IIN 2.4 -- -5 -10 1.8 1.3 -- -- -- 0.8 VDD+0.3 +10 V V V A 0V VIN VDD Sym Min Typ Max Units Conditions
Switching times ensured by design. Package power dissipation is dependent on the copper pad area on the PCB.
2004 Microchip Technology Inc.
DS21419C-page 3
TC4420/TC4429
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD 18V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Voltage Range Input Current Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Operating Input Voltage Note 1: IS VDD -- -- 4.5 0.45 60 -- 3 400 18 mA A V VIN = 3V VIN = 0V tR tF tD1 tD2 -- -- -- -- 32 34 50 65 60 60 100 100 ns ns ns ns Figure 4-1, CL = 2,500 pF Figure 4-1, CL = 2,500 pF Figure 4-1 Figure 4-1 VOH VOL ROH ROL VDD - 0.025 -- -- -- -- -- 3 2.3 -- 0.025 5 5 V V DC TEST DC TEST IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VIH VIL VIN IIN 2.4 -- -5 -10 -- -- -- -- -- 0.8 VDD + 0.3 +10 V V V A 0V VIN VDD Sym Min Typ Max Units Conditions
Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V. Parameters Temperature Ranges Specified Temperature Range (C) Specified Temperature Range (I) Specified Temperature Range (E) Specified Temperature Range (V) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 5L-TO-220 Thermal Resistance, 8L-CERDIP Thermal Resistance, 8L-6x5 DFN Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC JA JA JA JA JA -- -- -- -- -- 71 150 33.2 125 155 -- -- -- -- -- C/W C/W C/W C/W C/W Typical four-layer board with vias to ground plane. TA TA TA TA TJ TA 0 -25 -40 -40 -- -65 -- -- -- -- -- -- +70 +85 +85 +125 +150 +150 C C C C C C Sym Min Typ Max Units Conditions
DS21419C-page 4
2004 Microchip Technology Inc.
TC4420/TC4429
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V.
120
100
100 80 60
C L = 10,000 pF
80
Time (nsec)
Time (nsec)
60
C L = 10,000 pF
C L = 4700 pF
40
40
C L = 4700 pF C L = 2200 pF
C L = 2200 pF
20 0
20
5
7
9
11
13
15
0
5
7
9
11
13
15
Supply Voltage (V)
Supply Voltage (V)
FIGURE 2-1: Voltage.
100 80 60
Time (nsec)
Rise Time vs. Supply
FIGURE 2-4: Voltage.
100 80 60
Time (nsec)
Fall Time vs. Supply
40
VDD = 5V
40
VDD = 5V VDD = 12V VDD = 18V
VDD = 12V VDD = 18V 20
20
10 1000
Capcitive Load (pF)
10,000
10 1000
Capacitive Load (pF)
10,000
FIGURE 2-2: Load.
50
Rise Time vs. Capacitive
FIGURE 2-5: Load.
84
Fall Time vs. Capacitive
C L = 2200 pF VDD = 18V 40
Supply Current (mA)
VDD = 15V
70 56 42
Delay Time (nsec)
t D2
30
t D1
20
500 kHz
28
10
200 kHz
14
20 kHz
0 -60
-20
20 60 TA (C)
100
140
0
0
100 1000 Capacitive Load (pF)
10,000
FIGURE 2-3: Temperature.
Propagation Delay Time vs.
FIGURE 2-6: Capacitive Load.
Supply Current vs.
2004 Microchip Technology Inc.
DS21419C-page 5
TC4420/TC4429
Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V.
50 C L = 2200 pF VDD = 18V 40
5
100 mA
Time (nsec)
4
ROUT ( )
30
t FALL t RISE
10 mA
50 mA
20
3
10
0 -60
-20
20 60 TA (C)
100
140
2
5
7
9 11 13 Supply Voltage (V)
15
FIGURE 2-7: Temperature.
65 60
Rise and Fall Times vs.
FIGURE 2-10: High-State Output Resistance vs Supply Voltage.
200
Load = 2200 pF
160
Delay Time (nsec)
55 50 45 40 35 tD2
Delay Time (nsec)
120
Input 2.4V Input 3V
80 Input 5V 40 Input 8V and 10V
tD1
4
6
8
10
12
14
16
18
0
5 6 7 8 9 10 11 12 13 14 15 VDD (V)
Supply Voltage (V)
FIGURE 2-8: Supply Voltage.
1000
Propagation Delay Time vs.
FIGURE 2-11: Effect of Input Amplitude on Propagation Delay.
2.5
CL = 2200 pF
18V
Supply Current (mA)
100
10V
2
ROUT ( )
5V
100 mA 50 mA
1.5
10
10 mA
0
0 100 1000 Frequency (kHz) 10,000
1
5
7
9 11 13 Supply Voltage (V)
15
FIGURE 2-9: Frequency.
Supply Current vs.
FIGURE 2-12: Low-State Output Resistance vs. Supply Voltage.
DS21419C-page 6
2004 Microchip Technology Inc.
TC4420/TC4429
Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V.
4
-8
Crossover Area (A*S) x 10
3
2
1
0
5 6 7 8 9 10 11 12 13 14 15 Supply Voltage (V)
The values on this graph represent the loss seen by the driver during one complete cycle. For a single transition, divide the value by 2.
FIGURE 2-13:
Crossover Energy.
2004 Microchip Technology Inc.
DS21419C-page 7
TC4420/TC4429
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. 8-Pin CERDIP/ PDIP/SOIC
PIN FUNCTION TABLE
Pin No. 8-Pin DFN Pin No. 5-Pin TO-220 Symbol Description
1 2 3 4 5 6 7 8 -- --
1 2 3 4 5 6 7 8 PAD --
-- 1 -- 2 4 5 -- 3 -- TAB
VDD INPUT NC GND GND OUTPUT OUTPUT VDD NC VDD
Supply input, 4.5V to 18V Control input, TTL/CMOS compatible input No Connection Ground Ground CMOS push-pull output CMOS push-pull output Supply input, 4.5V to 18V Exposed Metal Pad Metal Tab is at the VDD Potential
3.1
Supply Input (VDD)
3.3
CMOS Push-Pull Output
The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 18V with respect to the ground pins. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A minimum value of 1.0 F is suggested.
The MOSFET driver output is a low-impedance, CMOS, push-pull style output capable of driving a capacitive load with 6.0A peak currents. The MOSFET driver output is capable of withstanding 1.5A peak reverse currents of either polarity.
3.4 3.2 Control Input
The MOSFET driver input is a high-impedance, TTL/CMOS compatible input. The input circuitry of the TC4420/TC4429 MOSFET driver also has a "speedup" capacitor. This helps to decrease the propagation delay times of the driver. Because of this, input signals with slow rising or falling edges should not be used, as this can result in double-pulsing of the MOSFET driver output.
Ground
The ground pins are the return path for the bias current and the high peak currents that discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return.
3.5
Exposed Metal Pad
The exposed metal pad of the 6x5 DFN package is not internally connected to any potential. Therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board (PCB) to aid in heat removal from the package.
DS21419C-page 8
2004 Microchip Technology Inc.
TC4420/TC4429
4.0 APPLICATIONS INFORMATION
+5V Input VDD = 18V 4.7 F 1 0.1 F Input 2 6 7 CL = 2,500 pF 4 5 0V +18V Input: 100 kHz, square wave, tRISE = tFALL 10 ns Output 0V 10% Non-Inverting Driver 8 0.1 F Output +5V Input 10% tD1 90% tR tD2 90% tF 10% 0V +18V Output 0V 10% Inverting Driver 10% 10% tD1 tF 90% tD2 tR 90%
90%
TC4429
90%
TC4420
Note: Pinout shown is for the PDIP, SOIC, DFN and CERDIP packages.
FIGURE 4-1:
Switching Time Test Circuits.
2004 Microchip Technology Inc.
DS21419C-page 9
TC4420/TC4429
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
5-Lead TO-220 Example:
XXXXXXXXX XXXXXXXXX YYWWNNN
TC4420CAT 0419256
8-Lead CERDIP (300 mil)
Example:
XXXXXXXX XXXXXNNN YYWW
TC4420 MJA256 0419
8-Lead DFN
Example:
XXXXXXX XXXXXXX XXYYWW NNN
TC4420 EMF 0419 256
Legend:
XX...X YY WW NNN
Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21419C-page 10
2004 Microchip Technology Inc.
TC4420/TC4429
Package Marking Information (Continued)
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example: TC4420 CPA256 0419
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN
Example: TC4420 EOA0419 256
2004 Microchip Technology Inc.
DS21419C-page 11
TC4420/TC4429
5-Lead Plastic Transistor Outline (AT) (TO-220)
L H1 Q b e3 e
e1
E
EJECTOR PIN
OP a (5X)
C1 J1 A F D
Lead Pitch Overall Lead Centers Space Between Leads Overall Height Overall Width Overall Length Flag Length Flag Thickness Through Hole Center Through Hole Diameter Lead Length Base to Bottom of Lead Lead Thickness Lead Width Mold Draft Angle
Units Dimension Limits e e1 e3 A E D H1 F Q P L J1 C1 b a
INCHES* MAX MIN .060 .072 .263 .273 .030 .040 .190 .160 .385 .415 .560 .590 .234 .258 .045 .055 .103 .113 .146 .156 .560 .540 .090 .115 .022 .014 .025 .040 3 7
MILLIMETERS MIN MAX 1.52 1.83 6.68 6.93 0.76 1.02 4.06 4.83 9.78 10.54 14.22 14.99 5.94 6.55 1.14 1.40 2.62 2.87 3.71 3.96 13.72 14.22 2.29 2.92 0.36 0.56 0.64 1.02 3 7
*Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC equivalent: TO-220
Drawing No. C04-036
DS21419C-page 12
2004 Microchip Technology Inc.
TC4420/TC4429
8-Lead Ceramic Dual In-line - 300 mil (JA) (CERDIP)
E1
2 n 1 D E A2 A
c eB A1 B1 B p
L
Number of Pins Pitch Top to Seating Plane Standoff Shoulder to Shoulder Width Ceramic Pkg. Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing *Controlling Parameter JEDEC Equivalent: MS-030
Drawing No. C04-010
Units Dimension Limits n p A A1 E E1 D L c B1 B eB
MIN
.160 .020 .290 .230 .370 .125 .008 .045 .016 .320
INCHES* NOM 8 .100 .180 .030 .305 .265 .385 .163 .012 .055 .018 .360
MAX
MIN
.200 .040 .320 .300 .400 .200 .015 .065 .020 .400
MILLIMETERS NOM 8 2.54 4.06 4.57 0.51 0.77 7.37 7.75 5.84 6.73 9.40 9.78 3.18 4.13 0.20 0.29 1.14 1.40 0.41 0.46 8.13 9.15
MAX
5.08 1.02 8.13 7.62 10.16 5.08 0.38 1.65 0.51 10.16
2004 Microchip Technology Inc.
DS21419C-page 13
TC4420/TC4429
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) - Saw Singulated
DS21419C-page 14
2004 Microchip Technology Inc.
TC4420/TC4429
8-Lead Plastic Dual In-line (PA) - 300 mil (PDIP)
E1
D 2 n 1 E
A
A2
c
L A1
eB
B1 p B
Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB
MIN
INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10
MAX
MIN
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15
MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10
MAX
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018
2004 Microchip Technology Inc.
DS21419C-page 15
TC4420/TC4429
8-Lead Plastic Small Outline (OA) - Narrow, 150 mil (SOIC)
E E1
p
D 2 B n 1
h 45
c A A2
L A1
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D h L c B
MIN
.053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0
INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12
MAX
MIN
.069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15
MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12
MAX
1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057
DS21419C-page 16
2004 Microchip Technology Inc.
TC4420/TC4429
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range XX Package XXX Tape and Reel X PB Free Examples:
a) TC4420CAT:
6A High-Speed MOSFET Driver, Non-inverting,
TO-220 package, 0C to +70C. b) TC4420EOA:
6A High-Speed MOSFET Driver, Non-inverting,
Device:
TC4420: TC4429:
6A High-Speed MOSFET Driver, Non-Inverting 6A High-Speed MOSFET Driver, Inverting
SOIC package, -40C to +85C.
Temperature Range: C I E V = = = = 0C to +70C (PDIP, SOIC, and TO-220 Only) -25C to +85C (CERDIP Only) -40C to +85C -40C to +125C
c)
TC4420VMF:
6A High-Speed MOSFET Driver, Non-inverting,
DFN package, -40C to +125C. a) TC4429CAT:
6A High-Speed MOSFET Driver, Inverting,
Package:
AT JA
= TO-220, 5-lead (C-Temp Only) = Ceramic Dual In-line (300 mil Body), 8-lead (I-Temp Only) MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) G = Lead-Free device* = Blank
TO-220 package, 0C to +70C b) TC4429EPA:
6A High-Speed MOSFET Driver, Inverting,
PDIP package, -40C to +85C c) TC4429VMF:
6A High-Speed MOSFET Driver, Inverting,
PB Free
* Available on selected packages. Contact your local sales representative for availability
DFN package, -40C to +125C
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2004 Microchip Technology Inc.
DS21419C-page 17
TC4420/TC4429
NOTES:
DS21419C-page 18
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21419C-page 19
WORLDWIDE SALES AND SERVICE
AMERICAS
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ASIA/PACIFIC
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ASIA/PACIFIC
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EUROPE
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08/24/04
DS21419C-page 20
2004 Microchip Technology Inc.

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